In addition to negative external influences such as oil-contaminated and humid ambient air and dust, heat is the number one enemy of today’s high-performance electronic components in enclosures.
Relative to each individual component, the heat loss of electronic components has diminished significantly in recent years. However, the packing density inside control cabinets has increased at the same time, resulting in a 50-60% increase in heat loss in enclosures.
With the advent of new electronics components, the requirements for enclosure construction has changed and thus also the requirements for heat dissipation from enclosures and electronic housings.
Modern enclosure climate control systems must take these new circumstances in account, offering the best technical solution while guaranteeing optimum energy efficiency. As mentioned, heat is the main reason for electronic component failure inside an enclosure. The service life of these components is halved, and the failure rate is doubled, in the event of a temperature increase of 10 K relative to the maximum permitted operating temperature.
Rittal has created a detailed handbook on calculating heat thermal management/cooling issues and how to manage heat dissipation. Get a copy of the handbook here.